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in stockReleased: 2004-03-26
UNE EN 60749-22:2004
Semiconductor devices - Mechanical and climatic test methods -- Part 22: Bond strength
Dispositivos de semiconductores. Métodos de ensayo mecánicos y climáticos. Parte 22: Robustez de las uniones soldadas.
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| Standard number: | UNE EN 60749-22:2004 |
| Pages: | 48 |
| Released: | 2004-03-26 |
| Status: | Standard |
DESCRIPTION
This standard UNE EN 60749-22:2004 Semiconductor devices - Mechanical and climatic test methods -- Part 22: Bond strength is classified in these ICS categories:
- 31.080.01