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Homepage>UNE standards>UNE EN 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (Endorsed by AENOR in July of 2014.)
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in stockReleased: 2014-07-01
UNE EN 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (Endorsed by AENOR in July of 2014.)

UNE EN 61190-1-2:2014

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (Endorsed by AENOR in July of 2014.)

Materiales de fijación para conjuntos electrónicos. Parte 1-2: Requisitos para las pastas de soldadura para interconexiones de alta calidad en conjuntos electrónicos. (Ratificada por AENOR en julio de 2014.)

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Standard number:UNE EN 61190-1-2:2014
Pages:26
Released:2014-07-01
Status:Standard
DESCRIPTION

This standard UNE EN 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (Endorsed by AENOR in July of 2014.) is classified in these ICS categories:

  • 31.190
Categories:
UNE standards
31.190 Electronic component assemblies
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