PRICES include / exclude VAT
Homepage>UNE standards>UNE EN 62047-18:2013 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (Endorsed by AENOR in November of 2013.)
Sponsored link
in stockReleased: 2013-11-01
UNE EN 62047-18:2013 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (Endorsed by AENOR in November of 2013.)

UNE EN 62047-18:2013

Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (Endorsed by AENOR in November of 2013.)

Dispositivos semiconductores. Dispositivos micro-electromecánicos. Parte 18: Métodos de ensayo de doblado para materiales de película fina. (Ratificada por AENOR en noviembre de 2013.)

Format
Availability
Price and currency
English PDF
Immediate download
64.90 EUR
English Hardcopy
In stock
64.90 EUR
Standard number:UNE EN 62047-18:2013
Pages:17
Released:2013-11-01
Status:Standard
DESCRIPTION

This standard UNE EN 62047-18:2013 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (Endorsed by AENOR in November of 2013.) is classified in these ICS categories:

  • 31.080.99