PRICES include / exclude VAT
Homepage>UNE standards>UNE EN 62047-25:2016 Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (Endorsed by Asociación Española de Normalización in January of 2017.)
Sponsored link
in stockReleased: 2017-01-01
UNE EN 62047-25:2016 Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (Endorsed by Asociación Española de Normalización in January of 2017.)

UNE EN 62047-25:2016

Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (Endorsed by Asociación Española de Normalización in January of 2017.)

Dispositivos semiconductores. Dispositivos microelectromecánicos. Parte 25: Tecnología de fabricación de MEMS basados en silicio. Método de medida de la resistencia al cizallamiento y al desprendimiento del área de micro unión. (Ratificada por la Asociación Española de Normalización en enero de 2017.)

Format
Availability
Price and currency
English PDF
Immediate download
74.80 EUR
English Hardcopy
In stock
74.80 EUR
Standard number:UNE EN 62047-25:2016
Pages:31
Released:2017-01-01
Status:Standard
DESCRIPTION

This standard UNE EN 62047-25:2016 Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (Endorsed by Asociación Española de Normalización in January of 2017.) is classified in these ICS categories:

  • 31.080.99