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Homepage>UNE standards>UNE EN 62047-9:2011 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (Endorsed by AENOR in June of 2012.)
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in stockReleased: 2012-06-01
UNE EN 62047-9:2011 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (Endorsed by AENOR in June of 2012.)

UNE EN 62047-9:2011

Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (Endorsed by AENOR in June of 2012.)

Dispositivos semiconductores. Dispositivos micro-electromecánicos. Parte 9: Medida de la resistencia de la unión oblea a oblea para NEMS. (Ratificada por AENOR en junio de 2012.)

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Standard number:UNE EN 62047-9:2011
Pages:29
Released:2012-06-01
Status:Standard
DESCRIPTION

This standard UNE EN 62047-9:2011 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (Endorsed by AENOR in June of 2012.) is classified in these ICS categories:

  • 31.080.99