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Homepage>UNE standards>UNE EN IEC 60749-37:2022 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (Endorsed by Asociación Española de Normalización in January of 2023.)
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in stockReleased: 2023-01-01
UNE EN IEC 60749-37:2022 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (Endorsed by Asociación Española de Normalización in January of 2023.)

UNE EN IEC 60749-37:2022

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (Endorsed by Asociación Española de Normalización in January of 2023.)

Dispositivos semiconductores. Métodos de ensayo mecánicos y climáticos. Parte 37: Método de ensayo de caída a nivel de tarjeta para componentes usando un acelerómetro. (Ratificada por la Asociación Española de Normalización en enero de 2023.)

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Standard number:UNE EN IEC 60749-37:2022
Pages:29
Released:2023-01-01
Status:Standard
DESCRIPTION

This standard UNE EN IEC 60749-37:2022 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (Endorsed by Asociación Española de Normalización in January of 2023.) is classified in these ICS categories:

  • 31.080.01