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Homepage>UNE standards>UNE EN IEC 61189-2-801:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials (Endorsed by Asociación Española de Normalización in October of 2023.)

in stockReleased: 2023-10-01

UNE EN IEC 61189-2-801:2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials (Endorsed by Asociación Española de Normalización in October of 2023.)

Métodos de ensayo para materiales eléctricos, tarjetas impresas y otras estructuras y montajes de interconexión. Parte 2-801: Ensayo de conductividad térmica para materiales de base. (Ratificada por la Asociación Española de Normalización en octubre de 2023.)

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Standard number:	UNE EN IEC 61189-2-801:2023
Pages:	19
Released:	2023-10-01
Status:	Standard

DESCRIPTION

This standard UNE EN IEC 61189-2-801:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials (Endorsed by Asociación Española de Normalización in October of 2023.) is classified in these ICS categories:

31.180

Categories:
UNE standards
31.180 Printed circuits and boards

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UNE EN IEC 61189-2-801:2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials (Endorsed by Asociación Española de Normalización in October of 2023.)