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Homepage>UNE standards>UNE EN IEC 61189-2-807:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (T<sub>d</sub>) using TGA (Endorsed by Asociación Española de Normalización in November of 2021.)
in stockReleased: 2021-11-01
UNE EN IEC 61189-2-807:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (T<sub>d</sub>) using TGA (Endorsed by Asociación Española de Normalización in November of 2021.)

UNE EN IEC 61189-2-807:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (T<sub>d</sub>) using TGA (Endorsed by Asociación Española de Normalización in November of 2021.)

Métodos de ensayo para materiales eléctricos, tarjetas impresas y otras estructuras y montajes de interconexión. Parte 2-807: Métodos de ensayo para materiales para estructuras de interconexión. Temperatura de descomposición (Td) usando TGA (Ratificada por la Asociación Española de Normalización en noviembre de 2021.)

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Standard number:UNE EN IEC 61189-2-807:2021
Pages:17
Released:2021-11-01
Status:Standard
DESCRIPTION

This standard UNE EN IEC 61189-2-807:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (T<sub>d</sub>) using TGA (Endorsed by Asociación Española de Normalización in November of 2021.) is classified in these ICS categories:

  • 31.180