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Homepage>UNE standards>UNE EN IEC 61189-2-808:2024 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method (Endorsed by Asociación Española de Normalización in July of 2024.)
in stockReleased: 2024-07-01
UNE EN IEC 61189-2-808:2024 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method (Endorsed by Asociación Española de Normalización in July of 2024.)

UNE EN IEC 61189-2-808:2024

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method (Endorsed by Asociación Española de Normalización in July of 2024.)

Métodos de ensayo para materiales eléctricos, tarjetas impresas y otras estructuras y montajes de interconexión. Parte 2-808: Resistencia térmica de un montaje por método de transitorios térmicos (Ratificada por la Asociación Española de Normalización en julio de 2024.)

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Standard number:UNE EN IEC 61189-2-808:2024
Pages:29
Released:2024-07-01
Status:Standard
DESCRIPTION

This standard UNE EN IEC 61189-2-808:2024 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method (Endorsed by Asociación Española de Normalización in July of 2024.) is classified in these ICS categories:

  • 31.180