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in stockReleased: 2018-04-01
UNE EN IEC 61190-1-3:2018
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (Endorsed by Asociación Española de Normalización in April of 2018.)
Materiales de fijación para conjuntos electrónicos. Parte 1-3: Requisitos para aleaciones de soldadura electrónica y soldaduras sólidas con y sin fundente para aplicaciones de soldadura electrónica (Ratificada por la Asociación Española de Normalización en abril de 2018.)
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| Standard number: | UNE EN IEC 61190-1-3:2018 |
| Pages: | 52 |
| Released: | 2018-04-01 |
| Status: | Standard |
DESCRIPTION
This standard UNE EN IEC 61190-1-3:2018 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (Endorsed by Asociación Española de Normalización in April of 2018.) is classified in these ICS categories:
- 31.190